Semi AOI
Wafer-Level Lithography AOI
Patented fluorescent is integrated to enhance fine line inspection in lithography process for 8’~12’ wafer with high detection rate and efficiency.
Wafer-Level IR AOI
Visible light and IR light are combined to inspect surface and inner defects after wafer sawed.
Wafer-Level Macro/Micro AOI
MVDA 2500 utilizes macro/micro inspection with multi-wavelength illumination, enabling comprehensive analysis solution for stress, IR, fluorescence, bevel detection…etc.
Panel-Level Packaging AOI
QUAD 2500 is designed for various FOPLP inspection needs, including appearance, dimension, line and hole detection, while offering precise TGV AOI solution at the same time.
Six-Sided Appearance AOI
HXA 2500 is capable to conduct multi-dimensional inspection of various packaging products in unit form.
